Heiko Stegmann

First experimental test of a new monochromated and aberration-corrected 200kV field-emission scanning transmission electron microscope

T Walther, Eckhard Quandt, Heiko Stegmann et al. · Ultramicroscopy · 2006 · 33 citations

Natural Sciences, Materials Science, Physics +9

Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstruction

Heiko Stegmann, Hans‐Jürgen Engelmann, Ehrenfried Zschech · Microelectronic Engineering · 2002 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16

Preliminary Results from the First Monochromated and Aberration Corrected 200-kV Field-Emission Scanning Transmission Electron Microscope

T Walther, Heiko Stegmann · Microscopy and Microanalysis · 2006 · 20 citations

Natural Sciences, Chemistry, Materials Science +15

From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis

Allen Gu, Masako Terada, Heiko Stegmann et al. · 2022 · 18 citations

Engineering, Computer Engineering, Materials Science +16

TEM Sample Preparation Using Focused Ion Beam - Capabilities And Limits

H-J Engelmann, B. Volkmann, Yvonne Ritz et al. · Microscopy Today · 2003 · 16 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +12