Concepedia

Kai Cheng Shie

KC

Statistics

Publications

2

Citations

54

H-Index

2

Active since

2019

Affiliations

National Yang Ming Chiao Tung University(Current)

Kai Cheng Shie is an author at National Yang Ming Chiao Tung University specializing in electronic packaging, mechanical engineering, and advanced packaging.

Top concepts

Publications per year

2019–2019

2

Publications

2

Instant Cu-to-Cu direct bonding enabled by 〈111〉-oriented nanotwinned Cu bumps

Kai Cheng Shie, Jing-Ye Juang, Chih Chen · Japanese Journal of Applied Physics · 2019 · 38 citations

Low-Resistance and high-Strength Copper Direct Bonding in no-Vacuum Ambient Using Highly (111)-Oriented Nano-Twinned Copper

Jing Ye Juang, Kai Cheng Shie, Po-Ning Hsu et al. · 2019 · 16 citations

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