Chang-Chae Shur

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

Jeong‐Won Yoon, Bo‐In Noh, Bong-Kyun Kim et al. · Journal of Alloys and Compounds · 2009 · 139 citations

Materials Science, Materials Engineering, Chemical Engineering +8

Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder

Chang‐Bae Lee, Seung‐Boo Jung, Young-Eui Shin et al. · MATERIALS TRANSACTIONS · 2002 · 90 citations · Full text

Friction Welding, Engineering, Mechanical Engineering +16

The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders

Chang‐Bae Lee, Seung‐Boo Jung, Young-Eui Shin et al. · MATERIALS TRANSACTIONS · 2001 · 69 citations · Full text

Engineering, Mechanical Engineering, Chemical Engineering +16

Characteristic evaluation of electroless nickel–phosphorus deposits with different phosphorus contents

Jeong‐Won Yoon, Jonghyun Park, Chang-Chae Shur et al. · Microelectronic Engineering · 2007 · 66 citations

Materials Science, Engineering, Different Phosphorus Contents +3

Effect of Cr on the corrosion resistance of Cu–6Ni–4Sn alloys

Woo-Yong Jeon, Chang-Chae Shur, J.G. Kim et al. · Journal of Alloys and Compounds · 2007 · 48 citations

Materials Science, Materials Engineering, Engineering +4