Concepedia

Young-Eui Shin

YS

14

Publications

363

Citations

11

H-Index

2001

Active since

Affiliations

Chung-Ang University(Current)

Sungkyunkwan University

Chung Cheong University

Technology Research Institute of Osaka Prefecture

Young-Eui Shin is an author at Chung-Ang University specializing in engineering, materials science, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringElectronic PackagingCorrosionMicrostructureMaterials EngineeringElectrical EngineeringApplied PhysicsMechanics Of Materials

Publications per year

2001–2019

14

Publications

14

Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder

Chang‐Bae Lee, Seung‐Boo Jung, Young-Eui Shin et al. · MATERIALS TRANSACTIONS · 2002 · 90 citations · Full text

Friction Welding, Engineering, Mechanical Engineering +16

The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders

Chang‐Bae Lee, Seung‐Boo Jung, Young-Eui Shin et al. · MATERIALS TRANSACTIONS · 2001 · 69 citations · Full text

Engineering, Mechanical Engineering, Chemical Engineering +16

Intermetallic compound layer formation between Sn–3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni–P/Cu) substrate

Chang‐Bae Lee, Jeong‐Won Yoon, Su‐Jeong Suh et al. · Journal of Materials Science Materials in Electronics · 2003 · 47 citations

Stress influences on the ultrasonic transducers

Seungmock Lee, Tsunehisa Tanaka, Koji Inoue et al. · Sensors and Actuators A Physical · 2004 · 21 citations

Engineering, Power Ultrasound, Ultrasonics +5

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Jeong Il Lee, Yuseon Heo et al. · MATERIALS TRANSACTIONS · 2012 · 18 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +15

Rows per page

1–5 of 14