Concepedia

Tom Bonifield

TB

3

Publications

78

Citations

3

H-Index

2005

Active since

Affiliations

Texas Instruments (United States)(Current)

Tom Bonifield is an author at Texas Instruments (United States) specializing in engineering, electrical engineering, and 3d printing.

Top concepts

EngineeringElectrical Engineering3D PrintingMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingMedicineDrug Analysis3D Integration

Publications per year

2005–2012

3

Publications

3

Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

Yiwei Wang, Seung‐Hyun Chae, Rajiv Dunne et al. · 2012 · 30 citations

Engineering, Imc Formation, Interconnect (Integrated Circuits) +19

Development of a stacked WCSP package platform using TSV (Through Silicon Via) technology

Rajiv Dunne, Yoshimi Takahashi, Kazuaki Mawatari et al. · 2012 · 28 citations

Engineering, Integrated Circuits, Package Platform +20

BEOL variability and impact on RC extraction

Nagaraj Ns, Tom Bonifield, Abha Singh et al. · 2005 · 20 citations

Solvent Extraction, Beol Variations, Engineering +16

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