E. Er

Formation of cobalt silicide spikes in 0.18 μm complementary metal oxide semiconductor process

Jiyan Dai, Zhenfang Guo, S.F. Tee et al. · Applied Physics Letters · 2001 · 32 citations

Engineering, Co Silicide Spikes, Silicon On Insulator +18

Development of a rapid and automated TEM sample preparation method in semiconductor failure analysis and the study of the relevant TEM artifact

Jiyan Dai, S.F. Tee, Chui Lam Tay et al. · Microelectronics Journal · 2001 · 18 citations

Failure analysis of bond pad metal peeling using FIB and AFM

Cher Ming Tan, E. Er, Younan Hua et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 17 citations

Engineering, Mechanical Engineering, Bond Pad Metal +21

Effect of BOE etching time on wire bonding quality

Cher Ming Tan, K. Linggajaya, E. Er et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 11 citations · Full text

Engineering, Mechanical Engineering, Bondpad Metal +16

High resistance via induced by marginal barrier metal step coverage and F diffusion

Jiyan Dai, S. K. Loh, S.F. Tee et al. · 2002 · 10 citations

Engineering, High Resistance, Tunneling Microscopy +17