Younan Hua

Studies on Quantification Analysis of Thin Film Layers (Si₃N₄, SiO₂, and TiW) in Wafer Fabrication Using Energy-Dispersive X-Ray Microanalysis Technique and SEC Factors

Younan Hua · Journal of Trace and Microprobe Techniques · 2003 · 19 citations

Quantification Analysis, Engineering, Sec Factors +20

Characterization studies of fluorine-induced corrosion crystal defects on microchip Al bondpads using X-ray photoelectron spectroscopy

Younan Hua, Zhenxiang Xing, Xiaomin Li · 2014 · 18 citations

Failure analysis of bond pad metal peeling using FIB and AFM

Cher Ming Tan, E. Er, Younan Hua et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 17 citations

Engineering, Mechanical Engineering, Bond Pad Metal +21

Electron-beam radiation induced degradation of silicon nitride and its impact to semiconductor failure analysis by TEM

Binghai Liu, Zhili Dong, Younan Hua et al. · AIP Advances · 2018 · 16 citations · Full text

Electron-beam Radiation, Engineering, Silicon On Insulator +17

Raw Materials for Making Jingdezhen Porcelain from the Five Dynasties to the Qing Dynasty

C. T. Yap, Younan Hua · Applied Spectroscopy · 1992 · 14 citations

Porcelain Stone, Engineering, Traditional Ceramic +14