Julia Röder

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Silicon Vias, Sip Modules +20

Detection of Aspergillus DNA by a nested PCR assay is able to improve the diagnosis of invasive aspergillosis in paediatric patients

Margit Hummel, Julia Röder, Gregor von Komorowski et al. · Journal of Medical Microbiology · 2009 · 55 citations

Diagnostic Mycology, Molecular Diagnostic Techniques, High Sensitivity +14

Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration

Kai Zoschke, Matthias Wegner, Martin Wilke et al. · 2010 · 34 citations

Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology

Kai Zoschke, Thorsten Fischer, Michael J. Topper et al. · IEEE Transactions on Advanced Packaging · 2010 · 20 citations

Engineering, Integrated Coils, Interconnect (Integrated Circuits) +16

Optical backplane for board-to-board interconnection based on a glass panel gradient-index multimode waveguide technology

Lars Brusberg, H. Schröder, Richard Pitwon et al. · 2013 · 18 citations

Engineering, Device Integration, Board Level +20