Julia Röder

Statistics

Publications

Citations

208

H-Index

Active since

2009

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Julia Röder is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electrical engineering, and integrated circuit design.

Publications per year

2009–2013

Publications

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +17

Detection of Aspergillus DNA by a nested PCR assay is able to improve the diagnosis of invasive aspergillosis in paediatric patients

Margit Hummel, Julia Röder, Gregor von Komorowski et al. · Journal of Medical Microbiology · 2009 · 55 citations

Medicine, Infectious Diseases, Pediatrics +17

Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration

Kai Zoschke, Matthias Wegner, Martin Wilke et al. · 2010 · 34 citations

Engineering, Electrical Engineering, Manufacturing Engineering +16

Thin glass based packaging technologies for optoelectronic modules

Lars Brusberg, H. Schröder, Michael J. Topper et al. · 2009 · 20 citations

Engineering, Materials Engineering, Materials Science +17

Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology

Kai Zoschke, Thorsten Fischer, Michael J. Topper et al. · IEEE Transactions on Advanced Packaging · 2010 · 20 citations

Engineering, Electrical Engineering, Materials Engineering +17

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