M. Tagami

Comprehensive Chemistry Designs in Porous SiOCH Film Stacks and Plasma Etching Gases for Damageless Cu Interconnects in Advanced ULSI Devices

Y. Hayashi, H. Ohtake, J. Kawahara et al. · IEEE Transactions on Semiconductor Manufacturing · 2008 · 24 citations

Engineering, Materials Engineering, Materials Science +17

Mechanical Property Control of Low-k Dielectrics for Diminishing Chemical Mechanical Polishing (CMP)-Related Defects in Cu-Damascene Interconnects

K. Hijioka, Fuminori Ito, M. Tagami et al. · Japanese Journal of Applied Physics · 2004 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +15

CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory

M. Tagami · 2023 · 20 citations

Engineering, Computer Engineering, Microelectronics +15

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

G. A. Antonelli, Gengwei Jiang, Roey Shaviv et al. · Microelectronic Engineering · 2011 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +16

Highly thermal-stable, plasma-polymerized BCB polymer film

J. Kawahara, Akinori Nakano, Kentaro Kinoshita et al. · Plasma Sources Science and Technology · 2003 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16