Chia-Te Lin

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Active since

2008

Affiliations

Chia-Te Lin is an author at Feng Chia University specializing in semiconductor devices, three-dimensional integration, and integrated circuit devices.

Publications per year

2008–2009

Publications

Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection

Li‐Cheng Shen, Chien-Wei Chien, Hsien‐Chie Cheng et al. · Microelectronics Reliability · 2009 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +14

A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via

Li‐Cheng Shen, Chien-Wei Chien, Jin-Ye Jaung et al. · 2008 · 10 citations

Engineering, Electrical Engineering, Materials Science +17

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