Hideki Naganuma

Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration

Kangwook Lee, Seiya Tanikawa, Mariappine Murugesan et al. · IEEE Electron Device Letters · 2013 · 30 citations

Engineering, Materials Engineering, Materials Science +15

Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration

Kangwook Lee, Takaharu Tani, Hideki Naganuma et al. · IEEE Electron Device Letters · 2012 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM

Kangwook Lee, Seiya Tanikawa, M. Murugesan et al. · IEEE Transactions on Electron Devices · 2014 · 16 citations

Engineering, Electrical Engineering, Materials Science +11