Arsalan Alam

Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects

Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam et al. · Journal of Computational Electronics · 2015 · 48 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +11

Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

Takafumi Fukushima, Arsalan Alam, Amir N. Hanna et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 46 citations · Full text

Si Dielets, Engineering, Vlsi Design +20

An Unconditionally Stable FDTD Model for Crosstalk Analysis of VLSI Interconnects

Vobulapuram Ramesh Kumar, Arsalan Alam, Brajesh Kumar Kaushik et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 40 citations

Numerical Analysis, Engineering, Vlsi Design +16

Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects

Amir N. Hanna, Arsalan Alam, Takafumi Fukushima et al. · 2018 · 26 citations

Engineering, Stress Buffer Layer, Mechanical Engineering +21

Expandable Polymer Enabled Wirelessly Destructible High‐Performance Solid State Electronics

Abdurrahman Gümüş, Arsalan Alam, Aftab M. Hussain et al. · Advanced Materials Technologies · 2017 · 23 citations

Miniaturization, Engineering, Emerging Memory Technology +16