Concepedia

M.B. Vincent

MV

6

Publications

172

Citations

6

H-Index

1998

Active since

Affiliations

Georgia Institute of Technology(Current)

M.B. Vincent is an author at Georgia Institute of Technology specializing in materials science, engineering, and microfabrication.

Top concepts

EngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMechanical EngineeringHeat TransferThermal Engineering3D PrintingSurface Modification

Publications per year

1998–2002

6

Publications

6

Characterization of a no-flow underfill encapsulant during the solder reflow process

C.P. Wong, D. Baldwin, M.B. Vincent et al. · 2002 · 52 citations

Materials Science, 3D Ic Architecture, Engineering +15

Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion

C.P. Wong, M.B. Vincent, Sheng Shi · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 46 citations

Engineering, Fluid Mechanics, Mechanical Engineering +20

Enhancement of underfill adhesion to die and substrate by use of silane additives

M.B. Vincent, L.G. Meyers, C.P. Wong · 2002 · 30 citations

Engineering, Silane Additives, Mechanical Engineering +19

Enhancement of underfill encapsulants for flip‐chip technology

M.B. Vincent, C.P. Wong · Soldering and Surface Mount Technology · 1999 · 20 citations

Materials Science, Advanced Packaging, Engineering +14

Enhancement of underfill performance for flip-chip applications by use of silane additives

M.B. Vincent, L.G. Meyers, C.P. Wong · 2002 · 13 citations

Engineering, Silane Additives, Mechanical Engineering +18

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