Qin‐Yi Tong

Low temperature wafer direct bonding

Qin‐Yi Tong, G. Cha, R. Gafiteanu et al. · Journal of Microelectromechanical Systems · 1994 · 193 citations

Engineering, Materials Engineering, Materials Science +16

Effect of two types of surface sites on the characteristics of Si3N4-gate pH-ISFETs

Meng-Nian Niu, Xin-Fang Ding, Qin‐Yi Tong · Sensors and Actuators B Chemical · 1996 · 79 citations

Engineering, Electrical Engineering, Materials Science +14

Transfer of semiconductor and oxide films by wafer bonding and layer cutting

Qin‐Yi Tong, Lijuan Huang, U. Gösele · Journal of Electronic Materials · 2000 · 36 citations

Engineering, Materials Engineering, Materials Science +16

Water-Enhanced Debonding of Room-Temperature Bonded Silicon Wafers for Surface Protection Applications

Qin‐Yi Tong, Roman Gafiteanu Roman Gafiteanu, Ulrich Gösele Ulrich Gösele · Japanese Journal of Applied Physics · 1992 · 16 citations

Engineering, Materials Engineering, Materials Science +17