Nay Lin

High Sensitivity, Miniature, Full 2-D Anemometer Based on MEMS Hot-Film Sensors

Hao-Bing Liu, Nay Lin, Shanshan Pan et al. · IEEE Sensors Journal · 2012 · 64 citations

Engineering, Measurement, Wearable Technology +22

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating

Pradeep Dixit, Chee Wee Tan, Luhua Xu et al. · Journal of Micromechanics and Microengineering · 2007 · 47 citations

Electrical Resistance, Engineering, Integrated Circuits +17

Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Pradeep Dixit, Nay Lin, Jianmin Miao et al. · Sensors and Actuators A Physical · 2007 · 38 citations

Engineering, Mems Packaging, Micromachines +11

Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation

Nay Lin, Jianmin Miao, Pradeep Dixit · Microelectronics Reliability · 2013 · 32 citations

Electrical Engineering, Engineering, Stress-induced Leakage Current +9

Optimization of Hot-Wire Airflow Sensors on an Out-of-Plane Glass Bubble for 2-D Detection

Shuwei Liu, Shanshan Pan, Fei Xue et al. · Journal of Microelectromechanical Systems · 2014 · 18 citations

Aeroacoustics, Engineering, Gas Sensor +21