Statistics
Publications
7
Citations
194
H-Index
7
Active since
1991
Affiliations
Hongwen Li is an author at Beijing University of Technology specializing in materials science, materials engineering, and natural sciences.
Publications per year
1991–2024
7
7
Remote plasma chemical vapor deposition of copper for applications in microelectronics
Hongwen Li, Eric Eisenbraun, Alain E. Kaloyeros · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1992 · 14 citations
Natural Sciences, Materials Engineering, Materials Science +15
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