Song Wang

184QPS/W 64Mb/mm²3D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System

Dimin Niu, Shuangchen Li, Yuhao Wang et al. · 2022 IEEE International Solid- State Circuits Conference (ISSCC) · 2022 · 57 citations

Artificial Sensitive Skin for Robotics Based on Electrical Impedance Tomography

Kai Liu, Yang Wu, Song Wang et al. · Advanced Intelligent Systems · 2020 · 56 citations · Full text

Medical Electronics, Engineering, Electronic Skin +19

A Stacked Embedded DRAM Array for LPDDR4/4X using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic-to-Memory Interface

Fujun Bai, Xiping Jiang, Song Wang et al. · 2020 · 34 citations

3D Ic Architecture, Electrical Engineering, Engineering +11

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV

Song Wang, Bing Yu, Wenwu Xiao et al. · 2023 · 18 citations

A 1596-GB/s 48-Gb Stacked Embedded DRAM 384-Core SoC With Hybrid Bonding Integration

Xiping Jiang, Fengguo Zuo, Song Wang et al. · IEEE Solid-State Circuits Letters · 2022 · 11 citations