Concepedia

Fengguo Zuo

FZ

Statistics

Publications

4

Citations

136

H-Index

4

Active since

2020

Affiliations

Institute of Microelectronics(Current)

University of Science and Technology of China

Xi'an UniIC Semiconductors (China)

Taiwan Semiconductor Manufacturing Company (China)

Chinese Academy of Sciences

Fengguo Zuo is an author at Institute of Microelectronics specializing in memory subsystem design, engineering, and computer architecture.

Publications per year

2020–2023

4

Publications

4

184QPS/W 64Mb/mm<sup>2</sup>3D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System

Dimin Niu, Shuangchen Li, Yuhao Wang et al. · 2022 IEEE International Solid- State Circuits Conference (ISSCC) · 2022 · 64 citations

Engineering, Computer Science, Computer Systems +12

A Stacked Embedded DRAM Array for LPDDR4/4X using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic-to-Memory Interface

Fujun Bai, Song Wang, Bing Yu et al. · 2020 · 39 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV

Song Wang, Bing Yu, Wenwu Xiao et al. · 2023 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 1596-GB/s 48-Gb Stacked Embedded DRAM 384-Core SoC With Hybrid Bonding Integration

Xiping Jiang, Fengguo Zuo, Song Wang et al. · IEEE Solid-State Circuits Letters · 2022 · 12 citations

Engineering, Computer Engineering, Computer Science +9

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