Fujun Bai

A Stacked Embedded DRAM Array for LPDDR4/4X using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic-to-Memory Interface

Fujun Bai, Xiping Jiang, Song Wang et al. · 2020 · 34 citations

3D Ic Architecture, Electrical Engineering, Engineering +11

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV

Song Wang, Bing Yu, Wenwu Xiao et al. · 2023 · 18 citations

Semantic Segmentation of Panoramic Images for Real-Time Parking Slot Detection

Cong Lai, Qingyu Yang, Yixin Guo et al. · Remote Sensing · 2022 · 16 citations · Full text

Image Classification, Scene Analysis, Image Analysis +14

A True Process-Heterogeneous Stacked Embedded DRAM Structure Based on Wafer-Level Hybrid Bonding

Song Wang, Xiping Jiang, Fujun Bai et al. · Electronics · 2023 · 11 citations · Full text

A Watermarking Technique for Hard IP Protection in Full-custom IC Design

Fujun Bai, Zhiqiang Gao, Yi Xu et al. · 2007 · 10 citations