Concepedia

Xiping Jiang

XJ

8

Publications

211

Citations

8

H-Index

2015

Active since

Affiliations

Xi'an UniIC Semiconductors (China)(Current)

Institute of Microelectronics

University of Science and Technology of China

Chinese Academy of Sciences

University of Chinese Academy of Sciences

Xiping Jiang is an author at Xi'an UniIC Semiconductors (China) specializing in computer architecture, microelectronics, and computer engineering.

Top concepts

EngineeringMicroelectronicsComputer EngineeringComputer ArchitectureElectrical Engineering3D MemoryMemory DevicesIntegrated Circuits

Publications per year

2015–2023

8

Publications

8

184QPS/W 64Mb/mm<sup>2</sup>3D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System

Dimin Niu, Shuangchen Li, Yuhao Wang et al. · 2022 IEEE International Solid- State Circuits Conference (ISSCC) · 2022 · 57 citations

Mechanical defect identification for gas‐insulated switchgear equipment based on time‐frequency vibration signal analysis

Yao Zhong, Jian Hao, Ruijin Liao et al. · High Voltage · 2020 · 39 citations · Full text

A Stacked Embedded DRAM Array for LPDDR4/4X using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic-to-Memory Interface

Fujun Bai, Xiping Jiang, Song Wang et al. · 2020 · 34 citations

3D Ic Architecture, Electrical Engineering, Engineering +11

A 4T2R RRAM Bit Cell for Highly Parallel Ternary Content Addressable Memory

Xuehong Wang, Linfang Wang, Wang Ye et al. · IEEE Transactions on Electron Devices · 2021 · 31 citations

Non-volatile Memory, Electrical Engineering, Match Cell +14

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV

Song Wang, Bing Yu, Wenwu Xiao et al. · 2023 · 18 citations

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