Concepedia

Se-Young Jang

SJ

3

Publications

71

Citations

3

H-Index

2001

Active since

Affiliations

Samsung (South Korea)(Current)

Korea Advanced Institute of Science and Technology

Se-Young Jang is an author at Samsung (South Korea) specializing in electronic packaging, electrical engineering, and microelectronics.

Top concepts

Publications per year

2001–2004

3

Publications

3

Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems

Se-Young Jang, Kyung W. Paik · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 33 citations

, , +15

CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength

Se-Young Jang, J.K. Wolf, O. Ehrmann et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 22 citations

, , +18

FCOB (Flip Chip on Board) reliability study for mobile applications

Se-Young Jang, Soon‐Min Hong, Min Young Park et al. · 2004 · 16 citations

, , +16

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