Sang‐Soo Hwang

The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits

Sang‐Soo Hwang, Sungyup Jung, Young‐Chang Joo · Journal of Applied Physics · 2007 · 43 citations

Cu Migration-induced Failure, Engineering, Integrated Circuits +16

The self-formatting barrier characteristics of Cu–Mg/SiO2 and Cu–Ru/SiO2 films for Cu interconnects

Seol-Min Yi, Kwang-Ho Jang, Jung-Uk An et al. · Microelectronics Reliability · 2008 · 24 citations

Materials Engineering, Materials Science, Electromigration Technique +11

Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability

Seol-Min Yi, Jung-Uk An, Sang‐Soo Hwang et al. · Thin Solid Films · 2007 · 15 citations

Materials Science, Electrical Reliability, Electrical Engineering +11

Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress

Sang‐Soo Hwang, Sungyup Jung, Young‐Chang Joo · Journal of Applied Physics · 2008 · 15 citations

Engineering, Bias Temperature Stress, Interconnect (Integrated Circuits) +16

45.3: On‐cell Projected Capacitive Type Touch Sensor for NBPC

Sang‐Soo Hwang, Sang Hyuck Bae, So‐Haeng Cho et al. · SID Symposium Digest of Technical Papers · 2010 · 13 citations

Tactile Sensing, Electrical Engineering, Electronic Devices +13