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Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability

Materials ScienceElectrical ReliabilityElectrical EngineeringElectromigration TechniqueInterconnect Process AdaptabilityEngineeringInterfacial AdhesionChip AttachmentElectronic PackagingThin FilmsMicroelectronicsThin Film ProcessingInterconnect (Integrated Circuits)Electrical Insulation