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The self-formatting barrier characteristics of Cu–Mg/SiO2 and Cu–Ru/SiO2 films for Cu interconnects

Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringSelf-formatting Barrier CharacteristicsCu–ru/sio2 FilmsSurface ScienceApplied PhysicsCu InterconnectsSemiconductor MaterialThin Film Process TechnologyThin FilmsThin Film ProcessingInterconnect (Integrated Circuits)