Yujin Jang - Concepedia

Author

Yujin Jang

Korea Basic Science Institute ORCID

Also Known As

Yujin Jang

Publications

190

Citations

H-Index

Concepts

All Affiliations

Korea Basic Science Institute Yeungnam University Daegu Gyeongbuk Institute of Science and Technology

About

Yujin Jang is an author at Korea Basic Science Institute specializing in applied physics, materials science, and engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	4	4	99
2	Applied Physics	4	4	99
3	Materials Science	4	4	99
4	Electrical Engineering	1	1	20
5	Nanomaterials	1	1	46

Yujin Jang

Publications

187

Citations

H-Index

Page 1

	Year	Citations
Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu Yujin Jang, Jun Beom Kim, Tae Eun Hong, Journal of Alloys and Compounds Materials ScienceEngineeringNanomaterialsNanotechnologyApplied Physics	2015	46
Low temperature atomic layer deposited molybdenum nitride-Ni-foam composite: An electrode for efficient charge storage Dip K. Nandi, Sumanta Sahoo, Tae‐Hyun Kim, Electrochemistry Communications	2018	28
Self-emitting blue and red EuOX (X = F, Cl, Br, I) materials: band structure, charge transfer energy, and emission energy Donghyeon Kim, Jae Ryeol Jeong, Yujin Jang, Physical Chemistry Chemical Physics	2018	27
Effect of thickness-dependent structural defects on electrical stability of MoS2 thin film transistors Ji-In Park, Yujin Jang, Jong‐Seong Bae, Journal of Alloys and Compounds Materials ScienceElectrical EngineeringThickness-dependent Structural DefectsEngineeringElectrical Stability	2019	20
Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier Jun Beom Kim, Dip K. Nandi, Tae Hyun Kim, Thin Solid Films Materials ScienceEngineeringNanotechnologySurface ScienceApplied Physics	2019	19
Hydrogen Evolution Reaction by Atomic Layer‐Deposited MoN<sub><i>x</i></sub> on Porous Carbon Substrates: The Effects of Porosity and Annealing on Catalyst Activity and Stability Rahul Ramesh, Sandesh Y. Sawant, Dip K. Nandi, ChemSusChem	2020	17
Atomic layer deposited Mo2N thin films using Mo(CO)6 and NH3 plasma as a Cu diffusion barrier Yonghwan Joo, Dip K. Nandi, Rahul Ramesh, Journal of Alloys and Compounds	2020	16
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect Ki-Yeung Mun, Tae Eun Hong, Taehoon Cheon, Thin Solid Films Materials ScienceRu Thin FilmsEngineeringDiffusion ResistanceSurface Science	2014	14

Page 1