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Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier

Materials ScienceEngineeringNanotechnologySurface ScienceApplied PhysicsThin FilmsLayered MaterialCu-diffusion BarrierWnx Thin FilmsChemical DepositionChemical Vapor DepositionAtomic Layer DepositionThin Film Processing