Yang Zhang

Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGA

Thomas E. Sarvey, Yang Zhang, Colman Cheung et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 33 citations

Engineering, Vlsi Design, Device Integration +21

Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration Platforms

Yang Zhang, Xuchen Zhang, Muhannad S. Bakir · IEEE Transactions on Electron Devices · 2018 · 31 citations

Digital Die-to-die Channels, Engineering, Vlsi Design +24

Thermal Evaluation of 2.5-D Integration Using Bridge-Chip Technology: Challenges and Opportunities

Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 24 citations

Engineering, Device Integration, Energy Efficiency +18

Review on the Prediction and Control of Structural Vibration and Noise in Buildings Caused by Rail Transit

Yuanpeng He, Yang Zhang, Yuyang Yao et al. · Buildings · 2023 · 24 citations · Full text

Railway Traffic, Engineering Noise Control, Engineering +20

WiFi-based non-contact human presence detection technology

Yang Zhang, Xuechun Wang, Jinghao Wen et al. · Scientific Reports · 2024 · 24 citations · Full text