C. A. Nichols

Ionized physical vapor deposition of Cu for high aspect ratio damascene trench fill applications

C. A. Nichols, S. M. Rossnagel, Satoshi Hamaguchi · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 60 citations

Materials Science, Plasma Electronics, Engineering +14

Thin, high atomic weight refractory film deposition for diffusion barrier, adhesion layer, and seed layer applications

S. M. Rossnagel, C. A. Nichols, Satoshi Hamaguchi et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 51 citations

Materials Science, Magnetism, Epitaxial Growth +15

Ion distribution functions in inductively coupled radio frequency discharges in argon–chlorine mixtures

J. R. Woodworth, M. E. Riley, Paul Miller et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1997 · 41 citations

Engineering, Glow Discharge, Radio Frequency Discharges +19

Surface dependent electron and negative ion density in inductively coupled discharges

G. A. Hebner, Matthew G. Blain, T. W. Hamilton et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1999 · 23 citations · Full text

Engineering, Glow Discharge, Negative Ion Density +17

Ion energy distribution functions in inductively coupled radio-frequency discharges—Mixtures of Cl2/BCl3/Ar

C. A. Nichols, J. R. Woodworth, T. W. Hamilton · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1998 · 20 citations

Electrical Engineering, Plasma Electronics, Engineering +14