Author
Yongmin Kwon
Also Known As
Kwon, Yongmin, Yong-Min Kwon, Yong-min Kwon, Yongmin Kwon
70
Publications
512
Citations
12
H-Index
52
Concepts
All Affiliations
| # | Concept | H-Index | Publications | Citations |
|---|---|---|---|---|
1 | Engineering | 11 | 13 | 301 |
2 | Chemistry | 4 | 4 | 111 |
3 | Applied Physics | 3 | 3 | 33 |
4 | Chemical Engineering | 3 | 3 | 79 |
5 | Computer Engineering | 3 | 3 | 81 |
Yongmin Kwon
×
16
Publications
374
Citations
12
H-Index
| Year | Citations | |
|---|---|---|
2020 | 52 | |
2022 | 44 | |
2010 | 38 | |
Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die Seon Young Yu, Yongmin Kwon, Jinsu Kim, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringMechanical EngineeringReliability EngineeringThermal Cycling ReliabilityAdvanced Packaging (Semiconductors) | 2012 | 37 |
2023 | 32 | |
2020 | 26 | |
2018 | 23 | |
2022 | 21 | |
2021 | 17 | |
2016 | 15 |
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