Gabriel Crăciun

Through-wafer copper electroplating for three-dimensional interconnects

Nam‐Trung Nguyen, E. Boellaard, Nga Pham et al. · Journal of Micromechanics and Microengineering · 2002 · 122 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Gabriel Crăciun, M. A. Blauw, E. van der Drift et al. · Journal of Micromechanics and Microengineering · 2002 · 55 citations

Deep Holes, Engineering, Silicon On Insulator +16

Advanced time-multiplexed plasma etching of high aspect ratio silicon structures

M. A. Blauw, Gabriel Crăciun, Willem G. Sloof et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 55 citations

Electrical Engineering, Engineering, Microfabrication +13

Physical properties of SIO2 thin films obtained by anodic oxidation

Mihail L. Grecea, C. Rotaru, N. Nastase et al. · Journal of Molecular Structure · 1999 · 29 citations

Materials Science, Engineering, Oxide Electronics +6

Electrodeposited copper nanocubes on multi-layer graphene: A novel nanozyme for ultrasensitive dopamine detection from biological samples

Livia Alexandra Gugoaşă, Sevinç Kurbanoğlu, Cosmin Romanițan et al. · Applied Surface Science · 2022 · 24 citations

Materials Science, Copper Nanocubes, Graphene Nanomeshes +10