J.M. Cech

Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films

A.F. Burnett, J.M. Cech · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1993 · 73 citations

Natural Sciences, Materials Engineering, Materials Science +17

High density interconnection using photosensitive polyimide and electroplated copper conductor lines

K. K. Chakravorty, Chung-Ping Chien, J.M. Cech et al. · Proceedings., 39th Electronic Components Conference · 2003 · 24 citations

Engineering, Electrical Engineering, Materials Engineering +15

High-density interconnection using photosensitive polyimide and electroplated copper conductor lines

K. K. Chakravorty, Chung-Ping Chien, J.M. Cech et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 20 citations

Engineering, Electrical Engineering, Materials Engineering +16

The signal transmission characteristics of embedded microstrip transmission lines over a meshed ground plane in copper/polyimide multichip module

Chung-Ping Chien, A.F. Burnett, J.M. Cech et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 18 citations

Engineering, Electrical Engineering, Circuit Theory +16

Photosensitive Polyimide as a Dielectric in High Density Thin Film Copper‐Polyimide Interconnect Structures

K. K. Chakravorty, J.M. Cech, Chung-Ping Chien et al. · Journal of The Electrochemical Society · 1990 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +14