Statistics
Publications
2
Citations
91
H-Index
2
Active since
1993
Affiliations
Boeing (United States)(Current)
A.F. Burnett is an author at Boeing (United States) specializing in multichip modules, electrical engineering, and thin films.
Publications per year
1993–1994
2
2
Chung-Ping Chien, A.F. Burnett, J.M. Cech et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 18 citations
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