G. Posada

Thin-film as enabling passive integration technology for RF SoC and SIP

G. Carchon, Xiao Sun, G. Posada et al. · 2005 · 40 citations

Engineering, Electrical Engineering, Microelectronics +16

Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

G. Posada, G. Carchon, Philippe Soussan et al. · 2007 · 14 citations

Engineering, Electrical Engineering, Microelectronics +16

High-resistivity silicon surface passivation for the thin-film MCM-D technology

G. Posada, G. Carchon, Philippe Soussan et al. · 2006 · 14 citations

Engineering, Electrical Engineering, Materials Science +17

Compact (<0.5 mm ² ) K-band metamaterial bandpass filter in MCM-D technology

Jordi Bonache, G. Posada, G. Carchon et al. · Electronics Letters · 2007 · 14 citations

Engineering, Electrical Engineering, Electronic Materials +16

Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules

G. Posada, G. Carchon, Bart Nauwelaers et al. · 2008 · 14 citations

Engineering, Electrical Engineering, Microelectronics +16