Thin-film as enabling passive integration technology for RF SoC and SIP

Abstract

Thin-film Cu/BCB technology with integrated inductors, resistors and capacitors is described for the realization of high-quality on-chip and in-package Si-based passive elements. Thin-film SiP and SoC inductor and transmission line performance is compared. A SiP 7GHz power splitter, a 50GHz BPF, and two 90nm CMOS VCO operating at 5.8GHz and 15GHz with on-chip thin-film inductors are discussed.