Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits

G. Carchon, Kristof Vaesen, S. Brebels, +3

IEEE Transactions on Components and Packaging Technologies

EngineeringPower ElectronicsHigh-performance RfInterconnect (Integrated Circuits)Electromagnetic Compatibility +19

Design considerations and technology assessment of phased-array antenna systems with RF MEMS for automotive radar applications

Joerg Schoebel, Thomas Bück, Mathias Reimann, +5

IEEE Transactions on Microwave Theory and Techniques

RadarRadar BeamsEngineeringRadio EngineeringDesign Considerations +11

Power and noise limitations of active circulators

G. Carchon, B. Nanwelaers

IEEE Transactions on Microwave Theory and Techniques

Quasi-circulator ArchitecturesElectrical EngineeringEngineering Noise ControlEngineeringPassive Isolation +6

Wafer-Level Packaging Technology for High-<tex>$Q$</tex>On-Chip Inductors and Transmission Lines

G. Carchon, W. De Raedt, Eric Beyne

IEEE Transactions on Microwave Theory and Techniques

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +14

A 9–31-GHz Subharmonic Passive Mixer in 90-nm CMOS Technology

Mingquan Bao, H. Jacobsson, Lars Aspemyr, +2

IEEE Journal of Solid-State Circuits

EngineeringRadio FrequencyHigh-frequency DeviceConversion LossMixed-signal Integrated Circuit +6

Optimization of 0-level packaging for RF-MEMS devices

Anne Jourdain, Xavier Rottenberg, G. Carchon, +1

Rf-mems DevicesElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors) +11

Thin-film as enabling passive integration technology for RF SoC and SIP

G. Carchon, Xiao Sun, G. Posada, +2

EngineeringRf SocPower SplitterDevice IntegrationThin Film Process Technology +14

MULTI-LAYER THIN-FILM MCM-D FOR THE INTEGRATION OF HIGH PERFORMANCE WIRELESS FRONT-END SYSTEMS

G. Carchon, Bart Nauwelaers, P. Pieters, +3

Microwave journal

3D Ic ArchitectureElectrical EngineeringEngineeringDevice IntegrationFlexible Electronics +9

High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA

Xiao Sun, O. Dupuis, Dimitri Linten, +5

IEEE Transactions on Advanced Packaging

Low-power ElectronicsElectrical EngineeringChip-scale PackageEngineeringRf Semiconductor +12

Low-power voltage-controlled oscillators in 90-nm CMOS using high-quality thin-film postprocessed inductors

D. Linten, Xiao Sun, G. Carchon, +11

IEEE Journal of Solid-State Circuits

Low-power ElectronicsPower ConsumptionElectrical EngineeringEngineeringRadio Frequency +13