Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits

Abstract

Thin-film multi-layer MCM-D technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high quality dielectrics and copper metallization, high quality transmission lines and inductors are available. This, together with the integrated passives design library containing scalable equivalent models for the inductors, capacitors, resistors, transmission lines and discontinuities, allows easy and accurate co-design between the passive and active devices. Examples of bandpass filters, power dividers, quadrature couplers, microwave feedthroughs, a DECT VCO and a 14 GHz LNA are given.