Concepedia
Statistics
Publications
2
Citations
46
H-Index
Active since
2009
Affiliations
Dai Nippon Printing (Japan)(Current)
Disco (japan)
Bunkyo University
Fujitsu (Japan)
The University of Tokyo
Y. S. Kim is an author at Dai Nippon Printing (Japan) specializing in wafer thinning, microelectronics, and semiconductor devices.
Publications per year
2009–2010
Ultra thinning 300-mm wafer down to 7-µm for 3D wafer Integration on 45-nm node CMOS using strained silicon and Cu/Low-k interconnects
Y. S. Kim, A. Tsukune, Noritoshi Maeda et al. · 2009 · 25 citations
Engineering, Electrical Engineering, Materials Science +17
Development of sub 10-µm ultra-thinning technology using device wafers for 3D manufacturing of terabit memory
Noritoshi Maeda, Y. S. Kim, Yukinobu Hikosaka et al. · 2010 · 21 citations
Engineering, Electrical Engineering, Materials Science +16
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