Concepedia

Erping Deng

ED

29

Publications

870

Citations

19

H-Index

2017

Active since

Affiliations

North China Electric Power University(Current)

State Grid Corporation of China (China)

Chemnitz University of Technology

Yantai University

Hefei University of Technology

Erping Deng is an author at North China Electric Power University specializing in engineering, electrical engineering, and microelectronics.

Top concepts

EngineeringElectrical EngineeringMicroelectronicsThermal EngineeringHeat TransferPower ElectronicsElectronic PackagingThermodynamicsApplied PhysicsThermal Modeling

Publications per year

2017–2023

29

Publications

29

Influence of Temperature on the Pressure Distribution Within Press Pack IGBTs

Erping Deng, Zhibin Zhao, Zhongkang Lin et al. · IEEE Transactions on Power Electronics · 2017 · 105 citations

Engineering, Mechanical Engineering, Power Electronics +17

Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs

Erping Deng, Zhibin Zhao, Qingming Xin et al. · Microelectronics Reliability · 2017 · 80 citations

Electrical Engineering, Engineering, Press Pack Igbts +5

Study on the Method to Measure the Junction-to-Case Thermal Resistance of Press-Pack IGBTs

Erping Deng, Zhibin Zhao, Peng Zhang et al. · IEEE Transactions on Power Electronics · 2017 · 57 citations

Engineering, Chip Submodule, Thermal Conductivity +16

Investigations on Averaging Mechanisms of Virtual Junction Temperature Determined by <i>V</i> <sub>CE</sub> (<i>T</i>) Method for IGBTs

Jie Chen, Erping Deng, Luhong Xie et al. · IEEE Transactions on Electron Devices · 2020 · 53 citations

Engineering, Power Electronics, Semiconductor Device +17

Study on the Method to Measure Thermal Contact Resistance Within Press Pack IGBTs

Erping Deng, Zhibin Zhao, Peng Zhang et al. · IEEE Transactions on Power Electronics · 2018 · 46 citations

Thermal Contact Resistance, Engineering, Mechanical Engineering +17

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