Zhongkang Lin

Influence of Temperature on the Pressure Distribution Within Press Pack IGBTs

Erping Deng, Zhibin Zhao, Zhongkang Lin et al. · IEEE Transactions on Power Electronics · 2017 · 112 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Current Measurement Method of Multiple Chips Using Rectangular PCB Rogowski Coils Integrated in Press Pack IGBT Device

Shi Fu, Xuebao Li, Zhongkang Lin et al. · IEEE Transactions on Power Electronics · 2022 · 38 citations

Engineering, Electrical Engineering, Microelectronics +16

The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module

Tong An, Zezheng Li, Yakun Zhang et al. · IEEE Transactions on Power Electronics · 2021 · 24 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization of thermal-shock cracks in ceramic bars

Xianghong Xu, Cheng Tian, Shilong Sheng et al. · Science China Physics Mechanics and Astronomy · 2014 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +14

Properties-enhanced gas sensor based on Cu-doped tellurene monolayer to detect acetone molecule: a first-principles study

Liang Wang, Zhongkang Lin, Yujie Du et al. · Molecular Physics · 2021 · 14 citations

Natural Sciences, Chemistry, Materials Science +17