Brent Goplen - Concepedia

Concepedia

Author

Brent Goplen

University of Minnesota

Also Known As

B. A. Goplen, B. Goplen, Brent Goplen

12

Publications

1.1K

Citations

9

H-Index

29

Concepts

All Affiliations

University of Minnesota

BG

About

Brent Goplen is an author at University of Minnesota specializing in microelectronics, computer engineering, and engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	1.1K
2	Computer Engineering	8	8	1.1K
3	Electrical Engineering	7	7	948
4	Applied Physics	4	4	524
5	Systems Engineering	1	1	159

Brent Goplen

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9

Publications

1.1K

Citations

9

H-Index

	Year	Citations
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach Brent Goplen, Sachin S. Sapatnekar International Conference on Computer Aided Design Technology NodeForce Directed ApproachEngineeringComputer-aided DesignComputational Mechanics	2003	219
Thermal via placement in 3D ICs Brent Goplen, Sachin S. Sapatnekar Numerical AnalysisEngineeringIntegrated CircuitsComputational MechanicsInterconnect (Integrated Circuits)	2005	197
Efficient thermal placement of standard cells in 3D ICs using a force directed approach Brent Goplen, Sachin S. Sapatnekar ICCAD-2003. International Conference on Computer Aided Design (IEEE Cat. No.03CH37486) Technology NodeForce Directed ApproachEngineeringComputer-aided DesignComputational Mechanics	2004	176
Placement of thermal vias in 3-D ICs using various thermal objectives Brent Goplen, Sachin S. Sapatnekar IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems EngineeringVlsi DesignComputer ArchitectureIntegrated CircuitsInterconnect (Integrated Circuits)	2006	167
Placement and Routing in 3D Integrated Circuits Cristinel Ababei, Yan Feng, Brent Goplen, IEEE Design & Test of Computers EngineeringVlsi DesignFpga Placement MethodComputer ArchitecturePhysical Design	2005	159
Placement of 3D ICs with thermal and interlayer via considerations Brent Goplen, Sachin Spatnekar Proceedings - ACM IEEE Design Automation Conference EngineeringWirelength ReductionsIntegrated CircuitsInterconnect (Integrated Circuits)Physical Design (Electronics)	2007	107
Temperature-Aware Placement for SOCs Jeng-Liang Tsai, C.C.-P. Chen, Guoqiang Chen, Proceedings of the IEEE EngineeringVlsi DesignComputer ArchitectureAccurate Thermal ModelingRefrigeration	2006	60
Placement of 3D ICs with Thermal and Interlayer Via Considerations Brent Goplen, Sachin S. Sapatnekar Proceedings - ACM IEEE Design Automation Conference	2007	26
Electrothermal analysis and optimization techniques for nanoscale integrated circuits Yong Zhan, Brent Goplen, Sachin S. Sapatnekar Numerical AnalysisEngineeringEnergy EfficiencyPower Optimization (Eda)Integrated Circuits	2006	22

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