Brent Goplen is an author at University of Minnesota specializing in microelectronics, computer engineering, and engineering.
Top concepts
EngineeringMicroelectronicsComputer EngineeringHeat TransferThermal EngineeringElectronic PackagingElectrical Engineering3D IntegrationThermal ModelingThree-dimensional Integrated Circuits
Publications per year
2003–2007
9
9
Thermal via placement in 3D ICs
Brent Goplen, Sachin S. Sapatnekar · 2005 · 197 citations
Placement and Routing in 3D Integrated Circuits
Cristinel Ababei, Yan Feng, Brent Goplen et al. · IEEE Design & Test of Computers · 2005 · 159 citations
Rows per page
1–5 of 9