ICCAD-2003. International Conference on Computer Aided Design (IEEE Cat. No.03CH37486) · 2004 · 176 citations · 10 references
EngineeringComputer EngineeringElectrical EngineeringFinite Element AnalysisFinite Element MethodsThermal AnalysisHeat Transfer AnalysisIntegrated Circuit DesignStandard Cell DesignThermal DesignThermal ManagementVery-large-scale Integration LayoutFinite Element Thermal AnalysisPlacementStandard Cell PlacementStandard CellsThermal Effects In Integrated CircuitsThermal ForcesThree-dimensional Integrated Circuit LayoutThree-dimensional Integration
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal placement method presented in this paper uses an iterative force-directed approach in which thermal forces direct cells away from areas of high temperature. Finite element analysis (FEA) is used to calculate temperatures efficiently during each iteration. Benchmark circuits produce thermal placements with both lower temperatures and thermal gradients while wirelength is minimally affected.
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