Concepedia

G Glinski

GG

Statistics

Publications

5

Citations

147

H-Index

5

Active since

2001

Affiliations

University of Greenwich(Current)

G Glinski is an author at University of Greenwich specializing in engineering, solder pastes, and materials engineering.

Publications per year

2001–2007

5

Publications

5

Correlation of solder paste rheology with computational simulations of the stencil printing process

R. Durairaj, G.J. Jackson, N.N. Ekere et al. · Soldering and Surface Mount Technology · 2002 · 52 citations

Engineering, Materials Engineering, Materials Science +13

A non-Newtonian computational fluid dynamics study of the stencil printing process

G Glinski, C. Bailey, K. Pericleous · Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science · 2001 · 42 citations

Engineering, Materials Engineering, Materials Science +17

Ultra-Fine Pitch Stencil Printing for a Low Cost and Low Temperature Flip-Chip Assembly Process

Robert W. Kay, G Glinski, C. Bailey et al. · IEEE Transactions on Components and Packaging Technologies · 2007 · 31 citations

Engineering, Materials Engineering, Computer-integrated Manufacturing +10

Simulation of the stencil printing process [solder pastes]

G Glinski, C. Bailey, K. Pericleous · 2002 · 11 citations

Engineering, Materials Engineering, Materials Science +16

Low temperature flip-chip packaging based on screen printing technology

Robert W. Kay, Marc P. Y. Desmulliez, C. Bailey et al. · 2003 · 11 citations

Engineering, Manufacturing Engineering, Materials Science +12

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