Jiawei Marvin Chan

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Active since

2017

Affiliations

Nanyang Technological University(Current)

Infineon Technologies (Singapore)

Jiawei Marvin Chan is an author at Nanyang Technological University specializing in semiconductor devices, semiconductor reliability, and reliability degradation mechanisms.

ORCID

Publications per year

2017–2018

Publications

Cu–Cu Bonding in Ambient Environment by Ar/N<sub>2</sub> Plasma Surface Activation and Its Characterization

Shen Lin Chua, Jiawei Marvin Chan, Simon Chun Kiat Goh et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 28 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Effects of Copper Migration on the Reliability of Through-Silicon Via (TSV)

Jiawei Marvin Chan, Kheng Chooi Lee, Chuan Seng Tan · IEEE Transactions on Device and Materials Reliability · 2018 · 21 citations

Engineering, Electrical Engineering, Materials Science +17

Reliability Evaluation of Copper (Cu) Through-Silicon Vias (TSV) Barrier and Dielectric Liner by Electrical Characterization and Physical Failure Analysis (PFA)

Jiawei Marvin Chan, Cheng Xu, Kheng Chooi Lee et al. · 2017 · 12 citations

Engineering, Electrical Engineering, Materials Engineering +17

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