Cheng Xu

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Publications

Citations

119

H-Index

Active since

2013

Affiliations

National Center for Advanced Packaging (China)(Current)

Chinese Academy of Sciences

Cheng Xu is an author at National Center for Advanced Packaging (China) specializing in engineering, materials engineering, and mechanical behavior of materials.

ORCID

Publications per year

2013–2023

Publications

Modified Arrhenius constitutive model and simulation verification of 2A12-T4 aluminum alloy during hot compression

Yingxiang Xia, Xuedao Shu, Qingdong Zhang et al. · Journal of Materials Research and Technology · 2023 · 73 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Effect of thermal annealing on TSV Cu protrusion and local stress

Xiangmeng Jing, Hongwen He, Liang Ji et al. · 2014 · 24 citations

Engineering, Electrical Engineering, Materials Science +17

Reliability Evaluation of Copper (Cu) Through-Silicon Vias (TSV) Barrier and Dielectric Liner by Electrical Characterization and Physical Failure Analysis (PFA)

Jiawei Marvin Chan, Cheng Xu, Kheng Chooi Lee et al. · 2017 · 12 citations

Engineering, Electrical Engineering, Materials Engineering +17

Effect of IMC growth on thermal cycling reliability of micro solder bumps

Haiyan Liu, Cheng Xu, Xiaoyang Liu et al. · 2013 · 10 citations

Engineering, Materials Engineering, Materials Science +17

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