Statistics
Publications
3
Citations
93
H-Index
3
Active since
2017
Affiliations
Tohoku University(Current)
Siva Chandra Jangam is an author at Tohoku University specializing in microelectromechanical systems, materials engineering, and chip packaging.
Publications per year
2017–2018
3
3
Takafumi Fukushima, Arsalan Alam, Amir N. Hanna et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 46 citations · Full text
Engineering, Electrical Engineering, Materials Engineering +17
Amir N. Hanna, Arsalan Alam, Takafumi Fukushima et al. · 2018 · 26 citations
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