Jaibir Sharma

Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices

Bangtao Chen, Vasarla Nagendra Sekhar, Ying Ying Lim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 47 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Fabrication of low pull-in voltage RF MEMS switches on glass substrate in recessed CPW configuration for V-band application

Jaibir Sharma, Krishanapura Nagendra, Amitava DasGupta · Journal of Micromechanics and Microengineering · 2012 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

Silicon-On-Nothing ScAlN pMUTs

David Sze Wai Choong, Daniel Ssu-Han Chen, Duan Jian Goh et al. · 2021 · 24 citations

Engineering, Materials Engineering, Materials Science +17

High Resolution, High Frequency Ultrasonic Ranging in Air with pMUTs

Yul Koh, David Sze Wai Choong, Daniel Ssu-Han Chen et al. · 2021 · 23 citations

Engineering, Mechanical Engineering, Acoustics +16

Effect of stress on the pull-in voltage of membranes for MEMS application

Jaibir Sharma, Amitava DasGupta · Journal of Micromechanics and Microengineering · 2009 · 21 citations

Engineering, Electrical Engineering, Materials Science +17