R. Wisnieff

Localization and Electron-Electron Interaction Effects in Submicron-Width Inversion Layers

R. G. Wheeler, Keunsu Choi, Alpana Goel et al. · Physical Review Letters · 1982 · 146 citations

Localization Part, Engineering, Electron-electron Interaction Effects +19

A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding

F. Liu, R. Yu, Anthony Young et al. · 2008 · 118 citations

Engineering, Cu Beol, Interconnect (Integrated Circuits) +18

Printing screens

R. Wisnieff · Nature · 1998 · 75 citations

Effect of SiC wafer miscut angle on the morphology and Hall mobility of epitaxially grown graphene

Christos Dimitrakopoulos, A. Grill, Timothy McArdle et al. · Applied Physics Letters · 2011 · 47 citations

Materials Science, Semiconductors, Electrical Engineering +12

Electroless Deposition of NiB on 15 Inch Glass Substrates for the Fabrication of Transistor Gates for Liquid Crystal Displays

Emmanuel Delamarche, James Vichiconti, W. S. Graham et al. · Langmuir · 2003 · 37 citations

Thin-film Transistor, Electroless Deposition, Engineering +28