Qiufa Luo - Concepedia

Author

Qiufa Luo

Huaqiao University ORCID

Also Known As

Q. Luo, Q.F. Luo, Qiufa Luo, Yaping Wu

Publications

709

Citations

H-Index

Concepts

All Affiliations

Huaqiao University

About

Qiufa Luo is an author at Huaqiao University specializing in materials science, engineering, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	14	588
2	Materials Science	14	14	588
3	Applied Physics	7	7	247
4	Materials Engineering	7	7	265
5	Chemical Engineering	2	2	69

Qiufa Luo

Publications

610

Citations

H-Index

Page 1

	Year	Citations
Study on nanomechanical properties of 4H-SiC and 6H-SiC by molecular dynamics simulations Zige Tian, Xipeng Xu, Feng Jiang, Ceramics International Materials ScienceEngineeringNanomaterialsNanotechnologyMechanical Engineering	2019	93
Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools Qiufa Luo, Jing Lu, Xipeng Xu Tribology International Materials EngineeringMaterials ScienceProcessing CharacteristicsEngineeringMaterial Processing	2016	82
A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools Qiufa Luo, Jing Lu, Xiang Xu Wear Materials ScienceEngineeringMaterial MachiningTool WearMechanical Engineering	2016	71
Removal mechanism of 4H- and 6H-SiC substrates (0001 and 0001¯) in mechanical planarization machining Jing Lu, Qiufa Luo, Xipeng Xu, Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture Si FaceEngineeringMechanical EngineeringMechanical Planarization MachiningMaterial Processing	2017	53
Photocatalysis assisting the mechanical polishing of a single-crystal SiC wafer utilizing an anatase TiO 2 -coated diamond abrasive Jing Lü, Yaguang Wang, Qiufa Luo, Precision Engineering Materials EngineeringMaterials ScienceChemical EngineeringSingle-crystal Sic WaferEngineering	2017	50
Surface damage of single-crystal diamond (100) processed based on a sol-gel polishing tool Yingchao Lin, Jing Lu, Ruilong Tong, Diamond and Related Materials Materials ScienceDiamond-like CarbonEngineeringMaterial ProcessingCorrosion	2018	49
Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing Qiufa Luo, Jing Lu, Zige Tian, Applied Surface Science Materials EngineeringMaterials ScienceWafer Scale ProcessingEngineeringMaterial Processing	2021	47
A novel approach to obtain near damage-free surface/subsurface in machining of single crystal 4H-SiC substrate using pure metal mediated friction Min Wu, Hui Huang, Qiufa Luo, Applied Surface Science Materials EngineeringMaterials ScienceEngineeringMicrofabricationPure Metal	2022	37
Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing Qiufa Luo, Jing Lu, Feng Jiang, Nanoscale	2023	22
Effects of processing parameters and grinding direction on the material removal mechanism of (100) surface single crystal diamond in self-rotating mechanical grinding Yongkang Xin, Jing Lü, Chen Li, Diamond and Related Materials Materials ScienceDiamond-like CarbonEngineeringMaterial ProcessingMechanical Engineering	2023	21

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