Jing Lu

Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

Yongchao Xu, Jing Lu, Xipeng Xu · Applied Surface Science · 2016 · 113 citations

Engineering, Materials Engineering, Materials Science +14

Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP

Yongchao Xu, Jing Lu, Xipeng Xu et al. · International Journal of Machine Tools and Manufacture · 2018 · 98 citations

Engineering, Materials Engineering, Materials Science +13

A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools

Qiufa Luo, Jing Lu, Xiang Xu · Wear · 2016 · 73 citations

Engineering, Materials Engineering, Ceramic Materials +14

Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing

Qiufa Luo, Jing Lu, Zige Tian et al. · Applied Surface Science · 2021 · 51 citations

Engineering, Materials Engineering, Materials Science +16

The effects of abrasive yielding on the polishing of SiC wafers using a semi-fixed flexible pad

Jing Lu, Yang Li, Xipeng Xu · Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture · 2015 · 49 citations · Full text

Engineering, Materials Engineering, Materials Science +17