Publication | Closed Access
Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing
47
Citations
40
References
2021
Year
Materials EngineeringMaterials ScienceWafer Scale ProcessingEngineeringMaterial ProcessingApplied PhysicsCarbideSemiconductor Device FabricationSurface ProcessingNanoscale Polishing
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